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Hyunkee Min, Woohyun Seo, Jemin Lee, Sungsoo Park, and Daesik Hong,"Reliability Improvement Using Receive Mode Selection in the Device-to-Device Uplink Period Underlaying Cellular Networks," IEEE Trans. Wireless Commun., Feb. 2011
[IEEE Trans. Wireless Commun.]
조회 66173
Status : | Published |
---|---|
Date : | 2011-02 |
Title : | Reliability Improvement Using Receive Mode Selection in the Device-to-Device Uplink Period Underlaying Cellular Networks |
Authors : | Hyunkee Min, Woohyun Seo, Jemin Lee, Sungsoo Park and Daesik Hong |
Journal : | IEEE Transactions on Wireless Communications |
Abstract : | Abstract: A new interference management scheme is proposed to improve the reliability of a device-to-device (D2D) communication in the uplink (UL) period without reducing the power of cellular user equipment (UE). To improve the reliability of the D2D receiver, two conventional receive techniques and one proposed method are introduced. One of the conventional methods is demodulating the desired signal first (MODE1), while the other is demodulating an interference first (MODE2), and the proposed method is exploiting a retransmission of the interference from the base station (BS) (MODE3). We derive their outage probabilities in closed forms and explain the mechanism of receive mode selection which selects the mode guaranteeing the minimum outage probability among three modes. Numerical results show that by applying the receive mode selection, the D2D receiver achieves a remarkable enhancement of outage probability in the middle interference regime from the usage of MODE3 compared to the conventional ways of using only MODE1 or MODE2. |
URL : | http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=5675650 |
Download : | http://mirinae.yonsei.ac.kr/?module=file...24564df813 |
.Hyunkee Min; Woohyun Seo; Jemin Lee; Sungsoo Park; Daesik Hong; , "Reliability
Improvement Using Receive Mode Selection in the Device-to-Device Uplink Period
Underlaying Cellular Networks," Wireless Communications, IEEE Transactions
on , vol.10, no.2, pp.413-418, February 2011
doi:
10.1109/TWC.2011.122010.100963
URL: http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=5675650&isnumber=5711712
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