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prototype filter
pilot signal
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link reliability
resource size control
interference to noise ratio
eigen decomposition
TS-W-OFDM
C-V2V
massive connectivity
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full-spreading NOMA
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mixed numerology
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Multiple access
MLP
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Deep learning
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non-orthogonal multiple access
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Computation offloading
TDD configuration
Singular Vale Decomposition
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Hyungsik Ju, Eunsung Oh, Daesik Hong, "Catching Resource-Devouring Worms in Next-Generation Wireless Relay Systems - Two-way Relay and Full-Duplex Relay" IEEE Communication Magazine., Sep 2009
[IEEE Commun. Mag.]
조회 59501
Status : | Published |
---|---|
Date : | 2009-09 |
Title : | Catching Resource-Devouring Worms in Next-Generation Wireless Relay Systems - Two-way Relay and Full-Duplex Relay |
Authors : | Hyugnsik Ju, Eunsung Oh, Daesik Hong |
Journal : | IEEE Communication Magazine |
Abstract : | In spite of their potential to improve the performance of wireless communication systems, relay-based communication systems face significant challenges, resource wastage. In this article we discuss resource efficiency in relay systems, particularly in two-way and full-duplex relay systems that utilize multiple antennas and improved duplexing to enhance system efficiency. We compare in detail the features, frame structures, performances, advantages and disadvantages, and technical challenges associated with TWRs and FDRs. Using illustrations of quantitative performance, we demonstrate that both of these approaches can efficiently reduce resource wastage in relay-based communication systems. |
URL : | http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=5277456 |
Download : | http://mirinae.yonsei.ac.kr/?module=file...247746ca9e |
Hyungsik Ju; Eunsung Oh; Daesik Hong; , "Catching resource-devouring worms in
next-generation wireless relay systems: Two-way relay and full-duplex relay,"
Communications Magazine, IEEE , vol.47, no.9, pp.58-65, September
2009
doi: 10.1109/MCOM.2009.5277456
URL: http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=5277456&isnumber=5277441
doi: 10.1109/MCOM.2009.5277456
URL: http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=5277456&isnumber=5277441
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